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> 3M dp-270, DP270 potting encapsulation compound, black
3M dp-270, DP270 potting encapsulation compound, black
An electrical grade two-part epoxy for potting and bonding electronic components, and is electrolytically non-corrosive to copper.
It has a 1:1 mix ratio and is a non-exotherming, high flow, opaque black product with a 70 minute worklife. This requires a 3M EPX dispenser and mixing nozzle. This kit contains 1.7 ounces.
For more info call us at 1(***)342-8860.
