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> New 300X320 smd bga desktop auto reflow oven+2 heaters
New 300X320 smd bga desktop auto reflow oven+2 heaters
300x320mm SMD BGA IC Desktop Auto Smart Reflow Oven
* Eight pre-set heat reflow temperature waveforms/curves for selection. Manual heating and forced cooling functions are also available
* Easy operation. The whole SMD/BGA soldering process is done automatically
* Infrared and hot air circulation heating. Temperature is more accurate and even
* Fuzzy temperature control and transparent drawer
* Can solder small SMT components. Can also be used for CHIP, SOP, PLCC, QFP single and double sided PCB soldering
* Max temperature that can be set is 280 C
* Max interior height: 45mm
* Product appearamce Dimensions: 16.9"x14.6"x10.2" (43x37x26cm)
* Effective soldering area 11.8"x12.6" (300x320mm)
* 1. International: 85Sn/15Pb 70Sn/30Pb
* 2. International: 63Sn/37Pb 60Sn/40Pb
* 3. American: Sn/Ag3.5 Sn/Cu.75 Sn/Ag4.0/Cu.5
* 4. American: Sn/Ag2.5/Cu.8/Sb.5 Sn/Bi3.0/Ag3.0
* 7 & 8: User-defined temperature curves
* 1 infrared heating lamp body with durability of more than 10,000 hours
* 1 circuit board support (PCB support)
* 1 disc with English user's manual contained
